Detailed Product Description

This product has excellent print capability and wide processing window, it designed for a broad range of applications, it is not content hanlide, no clean. Excellent joint reliability properties, it is formulated for both standard and fine pitch stencil printing, reduction in random solderballing levels in reflow process, no slump in room temperature and heat process, print speeds of up to 200mm/sec.

Halide content: pass AG chromate test

Copper mirror test: passed

Copper corrosiveness: passed

Powder size: type 2/type 3/type 4

Surface insulation resistance: >1*10¹⁰ohm

Viscosity (malcom 205): 115Pa.s(10rap)

Flux contents: 10-12%

Slump test: passed

RoHS compliance